Pyramax Vacuum Reflow Oven

The Pyramax Vacuum reflow oven has been designed for inline processing of PCB assemblies or products that require low solder voiding for critical performance applications. Heat dissipation applications such as thermal pads on SMT components can benefit from vacuum processing resulting in reduced solder voids, improved thermal transfer and increased yield.

The system has been designed with the requirements of large EMS, OEMs and high-volume automotive segments in mind. Processing temperatures of up to 350°C can be achieved with vacuum levels as low as 1 Torr. Integrated controls and fully automatic vacuum opera- tion is achieved via BTU’s proprietary WINCONTM, WindowsTM-based control system. The system has a maximum processing width of up to 457 x 457 mm (18 x 18 inches).

Key Benefits
•Solder voiding to <5% 
•Thermal uniformity +/- 2°C 
•Superior profile control 
•Full MES integration 
•Lowest liquidus time

Key Features
•Recipe controlled vacuum parameters
•Bell Jar vacuum chamber design
•Vacuum chamber process heating
•Easy maintenance access •Pass-thru mode
•Profile Guardian ready