SMT II by Teknek creates a new benchmark in SMT board cleaning. With Low Static Cleaning and Low Applied Pressure, SMT II creates the perfect method for removing contamination before solder paste print. Industry demands for increased traceability and integration have been addressed, SMT II comes with IPC Hermes as standard.
Get this effective low static board cleaning machine - SMT II by Teknek. Comes standard with IPC Hermes integration for increased traceability and performance. Learn more about our industry-leading product today.
Low Static Cleaning
Every part of SMT-II has been designed to clean boards within a low static environment. This is achieved through careful design along with patented elastomer and adhesive technology
① NT™ Rollers ② Low Static Adhesive ③ Pathways
Network
Communication between equipment within the SMT process has never been more important, not only will the SMT-II fully integrate into the process but will also come as standard with IPC-Hermes-9852 or SMEMA capability.
User friendly interface
With a new simple to use graphics user interface, SMT-II is easy to set up and run.
Low Applied Pressure
As technology drives the need for thinner and more complex boards, they can become more fragile. Applied pressure at any point in the assembly process may cause damage. SMT-II boasts the lowest applied pressure of any cleaner bringing high efficiency cleaning with no damage
Follow Me
An option on the new SMT-II is “Follow-Me”. If your SMT process is not being controlled by Hermes, this independent auto width change system continually monitors the moving rail on the machine before or after the SMT-II. During board change overs this feature removes the need for the operator to be involved increasing process up-time.
