3D Solder Paste Inspection

3D Solder Paste Inspection

Manufacturers often test the solder paste deposits using SPI (solder paste inspection) while making PCBs. 3D Solder Paste Inspection systems measure the volume of the solder pads before the components are applied and the solder melted. We have the solution for SPI (solder paste inspection). Please see below for details.

SOCIAL MEDIA

Please follow AssemCorp on social media!

CONTACT US

AssemCorp Elektronik A.Ş.

Mon - Sat of 08:30  to 17:30
Assemcorp Elektronik A.Ş.


ALL RIGHTS RESERVED. COPYRIGHT © 2017 - 2024 ASSEMCORP ELEKTRONİK A.Ş. APPLIED BY TAISOFT