The water-based, pH-neutral cleaning medium efficiently removes residues of solder paste containing leaded, lead-free or so-called No Clean solder pastes as well as of SMT adhesives from SMT stencils in automatic washing machines. The pH-neutral formula features excellent compatibility with the stencil materials commonly used. Due to the innovative formula, high bath loading values are achieved in comparison to standard cleaning agents, so that the intervals between bath changes can be significantly extended and the resulting volumes of waste for disposal are reduced.
Application notes: The cleaning agent can be excellently rinsed with water and itself. The cleaning medium is filled in the cleaning tank of the stencil washing machine at room temperature.
Note:
Consider approvals of equipment manufacturer!
Consider compatibility of SMT-stencil adhesive!
Customer Added Value
Efficient removal of solder paste and SMT-adhesive from stencils
The innovative formulation combines efficient cleaning, highest process safety and optimal work safety by replacing flammable and combustible
Optimum rinsability