SPARKLE TSURU 22, a high- grade resin cored solder, has been developed to eliminate these problems and features high workability and ultra low spattering.
Conventional soldering with resin cored solder makes points for each bonding portion. For soldering QFP terminals and connector pins, slide soldering, in which the iron si run laterally, is utilized because of its longer tact time. With conventional solder, the iron running speed is 5 to 7.5 mm/s for QFP. SPARKLE TSURU 22 allows a high running speed of 10 mm/s without bridging. Conventional solders produce bridges quite often.
SPARKLE TSURU 22 is twice as heat resistant as conventional solders. High heat capacity parts are heated to high temperatures and take longer to solder, increasing the possibility of icicles. SPARKLE TSURU 2 produces no icicles.
SPARKLE TSURU 22 features extremely low spattering, less than 1/50 of conventional solders. This drastically reduces poor contact caused by spatter and minimizes correction time and reduces cost.
High heat-resistant SPARKLE TSURU 2 does not discolor flux residue.
The flux in SPARKLE TSURU 22 has a high insulation resistance of more than 10132 even in a severe environment of 85° and 90% RH. This provides high reliability and prevents copper pattern corrosion and migration.
