Automated Fluid Dispensing with Advanced Process Control
The Quantum® Q-6800 Series offers uncompromising quality, speed, flexibility, and value with batch and inline dispensing for automotive, PCBA, and various electronic assembly applications.
The system includes a calibration station and advanced closed- loop process controls such as a fluid weight scale, patented Mass Flow Control (MFC), and Calibrated Process Jetting (CPJ).
These controls ensure the right amount of material is dispensed for each part from the beginning to the end of the production run. Dynamic Dispense Control (DDC) provides precise valve control for more accurate placement of dots and lines. With over 30 years of precision fluid dispensing experience, our worldwide engineering, applications development, and technical service network provide expert support from initial process development through full-scale production.
Features and Benefits
Supports CSP, BGA, and board-level underfill.
Supports surface mount adhesive, corner and edge bonding, dam and fill, potting and encapsulation, conductive epoxy, and case assembly applications.
Large dispense area (423 x 458 mm) ideal for dual-valve dispensing and a range of substrate sizes.
Range-finding laser height sensor enables fast, non- contact dispense height measurement.
A digital vision system with enhanced vision software enables quick finding and teaching of fiducials even when targets vary in size, contrast, or rotation.
Patented CPJ process control automatically compensates for changes in fluid viscosity for higher yield.
