Integra™ Series: Model 508.4
Selective Soldering System combining Scalability and Throughput
The Integra™ 508.4 is a multi-station selective soldering system designed for high-volume applications with maximum throughput. The Integra™ 508.4 has many unique features, including concurrent fluxing, preheating and soldering for faster processing time and reduced soldering cycle. Versatility. With its flexible configuration, the Integra™ 508.4 is a versatile selective soldering platform and can be equipped for either single, parallel or double processing. Use of a single dropjet fluxer and solder pot allows soldering of printed circuit boards as large as 508 x 508 mm (20.0 x 20.0 in.).
When configured with dual drop-jet fluxers and dual solder pots, the Integra™ 508.4 can be used in two different modes and is capable of processing up to 8 boards at one time. The parallel processing mode enables fluxing and soldering of two printed circuit boards at the same time doubling machine productivity.
The double processing mode allows soldering with multiple size nozzles within the same program enhancing flexibility and increasing productivity. A single drop-jet fluxer and dual solder pots can be used in the double processing mode and is ideally suited for the use of two different solder alloys without requiring physical changing of solder pots.
Value. With a reputation for innovation, comprehensive process solutions from Nordson SELECT ensure a maximum return on investment and low cost of ownership. From initial process development through full-scale production, you are supported by our experienced worldwide engineering, applications development and technical service network.
The Integra™ 508.4 is a fully configured SMEMA compatible selective soldering platform and is a reliable and costeffective solution for many demanding through-hole and SMT mixed-technology soldering applications including:
o Double-sided TH/SMT assemblies
o TH selective and mini-wave soldering
o Multiple solder alloy soldering without changing solder pots
Features and Benefits
Four-zone operation with concurrent fluxing, preheating and soldering for increased throughput with maximum preheat capabilities
Choice of single or dual drop-jet fluxers and solder pots for either simultaneous parallel or independent double processing modes
Parallel processing significantly increases machine throughput while double processing broadens soldering flexibility
Full titanium solder pots compatible with all solder alloys plus easy tool-free maintenance
Software control between different solder alloys without changing solder pots
